This event will feature presentations on the latest advancements in thermal management and thermal technology for electronics packaging, cooling, temperature sensing and control, thermal materials, systems design and management for optimizing device design properties. Topics will include all types of new thermal technology/research, applications of recent advancements in thermal science, thermal research and development, and the latest market trends in thermal materials, products and systems.

The conference is designed for design engineers, academia, system engineers, material scientists and product engineers, CTOs and R&D managers with organizations in industries and markets whose products, operations and services depend upon sophisticated and precise control of thermal properties and states.

Exhibiting Booth Number: #11

Presenting Short Course, Heat Pipes and Other Advanced Thermal Management Solutions: Register Now