Join us for a Webinar May 20th 

Microelectronic Packaging Failure Modes and Analysis

by Thomas Green

Wednesday, May 20, 2015, at 8:30-11:30 am PDT   Cost $300 per person

Register Here!                                

This 3-hour webinar, which costs $300, is intended to review and highlight the typical kinds of micro-electronic packaging related failures that occur during manufacturing, qualification and the unfortunate field failures. It includes a review of FA tools and techniques that are utilized to understand root cause of failure and guide corrective actions.  Understanding the design and packaging of microelectronic devices such as hybrids, RF microwave modules, Class III medical implants and other types of packaged microcircuits intended for high reliability systems is a critical aspect of reliability engineering.

The instructor shares his years of experience related root cause FA investigations of microcircuit packaging defects and failures. Mismatched CTEs and poorly designed packages geometries often lead to mechanical failure at the die and substrate interface or cracking at the heel of a wire or ribbon bond interconnect. Careful delid, visual inspection followed by SEM and EDAX/Auger are required to identify root cause. Reliability engineers must be cognizant of the full range of FA tools available to diagnose failures and, resist the temptation to rush to judgment, which often happens destroying valuable evidence along the way. The instructor will review real world specific examples of packaging failures and resultant FA analysis and problem resolution.

This webinar is intended for reliability engineers, design, quality and process engineers involved in microelectronic packaging.

Webinar Outline

Introduction to Microelectronic Packaging

Terminology and Product Definitions

• Hybrids, Microwave Modules, MEMS, Optoelectronic Devices, Class III implants

Typical Package Related Defects and failures

• Failure Analysis (FA) Process Flow
• Review of common FA equipment and procedures

Specific Examples of Package Related Failures and FA Investigation

• Die, substrate and package compatibility issues
• Coefficient of Thermal Expansion (CTE) problems
• Voiding under the die
• Silver dendrites growing from silver loaded epoxy

Wire and ribbon bond failures

• Bond lifts due to contamination
• Heel Cracks
• Excessive intermetallic formation

Package plating issues

• Plating issues that lead to wirebond failures
• Au embrittlement

Loose conductive particles and Murphy's law

• Foreign material identification and control

Hermetic package seal issues

• Moisture related failures
• Outgassing problems

Using Residual Gas Analysis (RGA) as an FA tool and process indicator

Non-hermetic molded package defects and failures

Case studies from the field

Instructor Biography

Thomas Green is the principle at TJ Green Associates LLC (www.tjgreenllc.com) a Veteran Owned Small Business focused on training and consulting for military, space and medical microelectronic devices. He has 30 years of experience in the field of microelectronics packaging and has worked at Lockheed Martin Astro Space and USAF Rome Laboratories. At Lockheed he was a Staff engineer responsible for the materials and manufacturing processes used in building custom high reliability space qualified hybrid microcircuits for military and commercial applications. Tom has demonstrated expertise in substrate fabrication, die bond, wirebond, seam sealing, leak testing and failure analysis processes.

After registering, you will receive a confirmation email containing information about joining the webinar.