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Physics of Failure for Building Reliability Into Products by Dr. Abhijit Dasgupta

Thursday, May 8, 2014 - 8:30am
United States

Dr. Dasgupta is well-known throughout the world. Don't miss this webinar. We will be recording it and you can purchase the link if the day or time are not convenient.

Physics of Failure for Building Reliability Into Products by Dr. Abhijit Dasgupta

Join us for a Webinar on May 8th 
 
This course offers an introductory understanding of some of the key
engineering accelerated test techniques needed to develop reliable
electronic products. Participants are presented with various physics of
failure methods to design and test for reliability. 
 
Participants will....
  • Learn how products really fail and understand key reliability issues.
  • Become acquainted with the failure modes and mechanisms associated with electronic devices and assemblies
  • Determine the stresses associated with the qualification of reliable electronic equipment and examine techniques to address problems of reliability
  • Investigate the usage and applicability of reliability standards and handbooks

Webinar Outline:

  • What is reliability ?
  • Why assess reliability ?
  • What reliability metrics make sense?
  • What is physics of failure?
  • Failure mechanisms, failure sites and failure modes
  • Lifecycle conditions and how they affect failures
  • PoF process as a proactive way to design & build reliability into a product
  • PoF tools
  • How do the manufacturing process and supply chain affect reliability ?
  • PoF examples
  • Reliability assessment & product qualification with accelerated stress testing
  • Design of accelerated stress test based on PoF principles
  • PoF Failure acceleration models
    • Temperature
    • Moisture and harsh chemical contaminants 
    • Mechanical stresses
    • Electrical stresses
    • Combined Stresses
  • Case Study: Example of PoF - based on accelerated stress testing

Dr. Abhijit Dasgupta, co-director of CALCE EPRC and faculty member at the University of Maryland, is and expert on physics of failure of electronic assemblies and interconnects and on methods to reduce cycle time for developing and qualifying electronic packaging. He has published widely, organized numerous conferences and workshops, and has served as an associate editor for the ASME Journal of Electronic Packaging.

Cost: $300 per person - +5 attendees at $270 per person

Date: Thursday, May 8, 2014

Time: 8:30 AM - 11:30 AM PDT

After registering you will receive a confirmation email containing information about joining the Webinar.

System Requirements

PC-based attendees

Required: Windows® 8, 7, Vista, XP or 2003 Server

Mac®-based attendees

Required: Mac OS® X 10.6 or newer

Mobile attendees

Required: iPhone®, iPad®, Android™phone or Android tablet

Space is limited.

Reserve your Webinar seat now at:

https://www1.gotomeeting.com/register/547307225