Cooling Techniques for Electronic Equipment by Steve Carlson
Wednesday, April 23, 2014 - 8:30am
United States
Join us for a Webinar on April 23rd
Cooling Techniques for Electronic Equipment by Steve Carlson 
It is not too late to register for this educational webinar to be held Wednesday. It will be recorded and you can purchase the link if the date and time are not convenient.
Don't wait until your electronic equipment over-heats or fails because of poor cooling. Find out if your present systems are adequately cooled, how to avoid many common cooling problems and how to design efficient, reliable cooling systems for many different types of electronic cabinets. The Purpose of this 3-hr webinar is to show designers and engineers an overview of the quick methods for designing electronic equipment to withstand severe thermal environments without failing. Tequniques are presented which will permit the evaluation and design of cost effective, compact cooling systems, without the aid of a large digital computer.
Learn simple design rules and guidelines, which can improve the effective cooling of your sophistcated electronic components used in today's military, industrial and commercial electronic systems. Learn methods for determining thermal stresses in lead wires and solder joints due to a mismatch in thermal expansions.
This course is based upon the popular book Cooling Teqniques for Electronic Equipment by Mr. Dave Steinberg. Questions are encouraged during the webinar, to make sure each participant understands the design techniques and applications presented.
Who should attend: R & D Electronic Engineers & Mgrs, Packaging Engineers, Quality & Reliability Engineers, Test Engineers, Mfg Engineers, Mechanical Engineers, Application & Sales Engineers.
Steve Carlson is a Mechanical Engineer Analyst at Northdrop Grumman Navigation Systems Divisions in Woodland Hills, CA. He received his BSME at Arizona State University and MSME at California State University Northridge and has expanded the classical techniques developed by Mr. Dave Steinberg to include Solid Modeling and Finite Element Analysis to reduce analysis time, improve accuracy and decrease product development time. He has worked on the mechanical design, analysis, testing and packaging of cost effective, sophisticated electronic equipment that must work with a high degree of reliability in harsh thermal, thermal cycling, vibration and shock environments. He has been involved in these areas related to commercial, industrial and military applications for many years.
Electronics Cooling Background
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Heat Transfer within Electronic Systems
- Conduction
- Natural and Forced Convection
- Radiation
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Types of Thermal Analyses
- Steady-State and Transient
- Common Electrical Components and their Construction
- Types of Electronic Enclosures
- Material Properties and Unit Conversions
Practical Conduction Cooling Design Guidelines
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Calculate Temperature Rise
- Concentrated Heat Loading
- Uniform Heat Loading
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Determine Heat Flow
- Tracing a Heat Conduction Path from Heat Source to Sink
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One and Two Dimensional Resistor Networks
- Parallel and Series Heat Flow
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Printed Circuit Boards (PCB)
- Determine Component Junction Temperature θcb & θjc
- Using Internal Ground and Voltage Planes to Spread Heat
- Calculate effective PCB Thermal Conductivity
- Mounting High Power components on Circuit Boards
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Calculate Thermal Interface Impedance
- Bolted Contact Resistance
- Effects of Surface Finish, Hardness and Pressure on Interface Resistance
- Thermal Resistance Across different Board Edge Guides
- Sample Problems to Promote Better Understanding
Mounting Various Types of Components on Circuit Boards
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Problems with Surface Mounting Components
- Leadless Chip Carriers, Transformers, Ball Grid Arrays, Large Multi-Chip Modules, and Large Fine Pitch Leaded Components
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Problems with Through Hole Mounting Components
- Pin Grid Arrays
- Small Axial Leaded Resistors
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Lead Wire Strain Relief
- Various Types of Lead Wire Strain Relief to Prevent Solder Failures
- Avoiding Cracking of Chip Resistors and Capacitors
- Case Histores on Successes and Failures
Effective Natural Convection and Radiation Cooling
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Free Convection
- Required Spacing Between Circuit Boards for Good Cooling
- How Altitude Effects Natural Convection Cooling
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Finned Heat Transfers Surfaces
- Adding External Fins on a Box to Improve Cooling
- Making Effective Use of Extruded Fin Heat Sinks
- Methods for Increasing Convection and Radiation Coefficients
- Combining Convection and Radiation Cooling
- Radiation Heat Transfer
- Sample Problems to Demonstrate Practical Applications
Methods for Improving Forced Convection Cooling
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Cooling Fans
- Air Flow Properties of Fans and Blowers (Fan Curve)
- Working with Sigma Delta Pressure Drop
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Fan Location
- Typical Problems with Improper Fan Installation
- How to Determine and Cure Short Circuit Cooling Air Flow Path
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Flow Losses
- Understanding Static Velocity and Total Pressure
- Flow Losses Due to Entrance, Exit, Expansion and Turns
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Fan Selection
- matching the Impedance Curves for Chassis and Fan
- Sample Problems to Illistrate Cost Effective Applications
Practical Design and Analysis Guidelines
- Hand-calculation confirm Finite element Analysis results
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Coefficient of Thermal Expansion
- Thermal Expansion Equilibrium Equations, Lead Wires, Solder
- Slow Thermal Cycling Solder Creep Forces, Stresses, Fatigue Life
- Case Histories to Promote Improved Electronic Design
Cost: $300 per person - +5 attendees at $270 per person
Date: Wednesday, April 23, 2014
Time: 8:30 AM - 11:30 AM PDT
After Registering you will reveive a Confirmation email containing information about joining the Webinar
System Requirements
PC-based attendees
Required: Windows 8, 7, Vista, XP or 2003 Server
Mac-based attendees
Required: Mac OS X 10.6 or newer
Mobile attendees
Required: iPhone, iPad, Android™ phone or Android tablet
Space is limited.
Reserve your Webinar seat now at:
https://www1.gotomeeting.com/register/677434896
