EMC+SIPI 2017

Talk with us in Booth 732 

Teledyne LeCroy will be in exhibiting in Booth 732 as well as contributing to the technical conference.

Booth demonstrations include:

• EMC/ ESD Measurements using an Oscilloscope
• Measure first peak current, and t1, t2 voltage levels after pulse
• Calculate time to halflife automatically
• Use EMC 0-volts to maximum for the most accurate ESD pulse measurements
• Calculate time to halflife automatically
• Power integrity measurements using an Oscilloscope.
• Techniques for improving signal integrity measurements

Technical Contributions:

• Sr. Field Applications Engineer Mike Hertz will present: "Detection Methods for Secondary ESD Discharge during IEC 61000-4-2 Testing" in Room Maryland D on Tue, Aug 8 from 2:00 - 2:45PM
• Dr. Eric Bogatin will participate in the "Ask the Experts - SIPI Panel" in the Exhibit Hall Theatre on Wed, Aug 9 from 10:30AM – 12:00PM
• Sr. Field Applications Engineer Mike Hertz will present:"ESD Measurement Techniques With Oscilloscopes" in the Rear of the Exhibit Hall on Thu, Aug 10 9:00 - 11:00AM
• Dr. Eric Bogatin will present: "Development of a PCB Kit for S-Parameter De-Embedding Algorithms Verification" in room Maryland A on Thu, Aug 10 from 8:30 – 9:00AM
• Dr. Eric Bogatin will present: "Metrics for the Quality to Validate the De-Embedded DUT Result" in room Maryland D on Fri, Aug 11 from 2:25 – 3:00PM

Details & Registration:

http://www.emc2017.emcss.org