Preventing Thermal & Vibration Failures in Electronic Equipment webinar
Preventing Thermal & Vibration Failures in Electronic Equipment
by Steve Carlson
Wednesday, March 9, 2016, at 8:30-11:30 am PDT Cost $300 per person
This 3-hour webinar by Steve Carlson is an overview of his 2-day seminar and will focus on these three topics:
* To understand how variations in coefficients of thermal expansion (CTE) can affect the magnitude of the displacements, forces, and stresses that are developed in electronic assemblies during thermal cycling environments and how these factors affect fatigue life.
* To understand how resonant conditions can affect dynamic displacements, forces and stresses in electronic assemblies during different sine and random vibration environments.
* To understand the concept of "damage accumulation" and how it can be used to determine the approximate fatigue life of various electronic assemblies due to different combinations of fatigue accumulated in thermal cycling and vibration environments.
This course is based upon the popular book Preventing Thermal and Vibration Failures in Electronic Equipment by Prof. Dave Steinberg.
Who should attend:
* R&D Electronic Engineers & Managers
* Packaging Engineers
* Quality & Reliability Engineers
* Test Engineers
* Manufacturing Engineers
* Mechanical Engineers
* Application & Sales Engineers
Steve Carlson is a Mechanical Engineer Analyst at the Jet Propulsion Laboratory in Pasadena, CA. He received his BSME at Arizona State University and MSME at California State University Northridge and has expanded the classical techniques developed by Mr. Dave Steinberg to include Solid Modeling and Finite Element Analysis to reduce analysis time, improve accuracy, and decrease product development time. He has worked on the mechanical design, analysis, testing and packaging of cost effective sophisticated electronic equipment that must work with a high degree of reliability in harsh thermal, thermal cycling, vibration and shock environments. He has been involved in these areas related to commercial, industrial and military applications for many years. He is the Principal Engineer at Carlson Mechanical Engineering and has provided consultant services to multiple companies in the areas of heat transfer, sine/random vibration and computational fluid dynamics.
Webinar Outline:
PHYSICS OF FAILURE IN ELECTRONIC SYSTEMS
- Areas That Require Analysis and Evaluation
- How Thermal Cycling Environments Affect Fatigue Life
- How Vibration Environments Affect Fatigue Life
- Creep and Stress Relaxation in Solder
- Combining Fatigue Damage From Many Different Environments
MOUNTING METHODS FOR VARIOUS TYPES OF ELECTRONIC COMPONENTS
- Different Types of Electronic Components and PCB Mountings
- Fatigue Life Due to Various Component Geometry and Materials
- Package Types that Yield Rapid Fatigue Failure
- Areas Where Minor Structural Changes Can Produce Large Increases In Fatigue Life
- Tips To Improve Heat Dissipation.
ESTIMATING FATIGUE LIFE - THERMAL AND VIBRATION ENVIRONMENTS
- Solder Thermal Cycle and Vibration S-N Fatigue Curves
- Solder Creep With Constant Stress and With Constant Displacement
- Solder Creep and Stress Relaxation
- Solder Creep Stress Relaxation as a Function of Time
- Fatigue Damage In Structures Using Miner's Cumulative Damage Criteria
- Relating Fatigue Properties to the Slope of the Fatigue Curve
THERMAL EXPANSION DISPLACEMENTS, FORCES AND STRESSES
- Reducing Forces and Stresses In Lead Wires and Solder Joints
- Coefficient Of Thermal Expansion Differences Leads to Relative Displacement
- Evaluate Axial and Bending Forces on Lead Wires and Solder Joints
- Sample Problem: Solder Joint Shear Tear-out Stress and Lead Wire Bending Stress of Through-Hole Mounted Component during Thermal Cycling
THERMAL CYCLING STRESS FAILURES IN SURFACE MOUNTED COMPONENTS
- Solder Shear Strain in Surface Mounted Components
- Equilibrium Equation for Evaluating Thermal Expansion Forces and Stresses in the Solder Joints of a Small LCCC
VIBRATIONS OF SIMPLE STRUCTURES AND PRINTED CIRCUIT BOARDS
- Determining the Natural Frequency of Beams and Flat Plates
- Effective Spring Rate for Springs in Series and Parallel
- Displacement, Forces and Stress Due to Input Acceleration
- Damping & Transmissibility of PCBs and Other Electronic Structures
- PCB and Support Structure Dynamic Coupling
DESIGNING ELECTRONIC EQUIPMENT FOR SINUSOIDAL VIBRATION
- How PCB Component Size, Location, and Orientation Effect the Fatigue Life
- Sample Problem: TO-5 Transistor Lead Wire and Solder Joint Fatigue Life During Sine Vibration
- Maximum Allowable PCB Dynamic Displacement for Component Fatigue Life of 10 Million Stress Cycles
- Desired PCB Resonant Frequency for 10 Million Stress Cycles in Sine Vibration
ASSESSMENT OF RANDOM VIBRATION ON ELECTRONIC DESIGN
- How Random Vibration Differs from Sinusoidal Vibration
- Random Vibration Analysis Using the Three-Band Technique
- Sample Problem: Estimating the Fatigue Life Using the Three-Band Technique with Miner's Cumulative Fatigue Damage Ratio
COMBINING THERMAL CYCLING AND VIBRATION FATIGUE DAMAGE
- Alternating Stress Superimposed Upon a Steady Stress
- Vibration Test Data Failure in Pin Grid Array Wires at Low Temperatures
- Combining Thermal Cycling and Vibration Damage
- Miner's Combined Cumulative Fatigue Damage Criteria
FINITE ELEMENT ANALYSIS METHODS AND TECHNIQUES
- Finite Element Analysis (FEA) Methods to Determine Resonant Frequency, Forces and Stresses
- Utilize Displacement, Forces, Stresses and Temperatures from FEA to Determine Total Damage Due to Various Environments
Cost: $300 per person, 5 or more attendees from same company $270 per person
Date: Wednesday, April 22, 2015
Time: 8:30-11:30 am PDT (California)
After registering, you will receive a confirmation email containing information about joining the webinar.
We have been there for your reliability needs for the past 37 years and appreciate your continued interest in our webinars and seminars. If you know of others that may be interested in what we have to offer, please have them contact us.
If you find that the date and time for this webinar is inconvenient for you, we will be recording it and the link can be purchased for viewing at your leisure. Contact us for more information. learn@hobbsengr.com
