Embedded computing systems used in many military and industrial applications are trending toward higher heat fluxes and power requirements. As a result, performance is being hindered by thermal limitations. This is intensified by harsh ambient conditions experienced in many of today’s applications. The thermal path typically involves a heat spreader to get heat from the electronics components to the chassis rail, a retainer clamp/lock to mechanically and thermally couple the card to the chassis and heat spreading or dissipation from the outside of the enclosure.

This webinar will provide insight to enhance each level of the thermal resistance network, primarily by increasing the effective thermal conductivity with passive thermal technologies. This method is highly reliable and easy to retrofit into existing designs. High Conductivity (HiK™) conduction cards, enhanced thermal locks, and high conductivity chassis enhancements will be investigated as well as best practices for designing the ultimate air or liquid cooled heat sink. Viewers will come away with a strong understanding of passive technologies such as heat pipes, vapor chambers and ACT’s new ICE-Lok™ technology.

For more information on the presented active thermal technologies, please visit www.1-ACT.com.

Speakers:

Bryan Muzyka, Sales Manager, Advanced Cooling Technologies, Inc.

Bryan graduated with a B.S. in Mechanical Engineering from Penn State University and Master in Business Administration & Engineering degree from Lehigh University. He worked as Research and Development Engineer for ACT's Aerospace Products Group before taking on his current business development role. Bryan is currently Sales Manager for ACT's Defense Aerospace and Custom Products Group, responsible for product and technology sales across numerous industries. Bryan has firsthand experience designing, analyzing, integrating and working with customers to optimize solutions involving heat pipes, phase change material, liquid cold plates and pumped two-phase cooling.

Jens Weyant, Manager Def/Aero Products, Advanced Cooling Technologies, Inc.

Jens holds a BS degree in physics and a MS degree in engineering science, and has worked at Advanced Cooling Technologies, Inc for 10 years.  During his time at ACT he has worked in R&D, product development, and production.  He has contributed to thermal solutions for embedded computing, radar, power electronics, direct energy weapons, and space-flight components.  Many solutions involve two-phase solutions, including liquid-to-vapor heat transfer and solid-to-liquid thermal storage.  He was awarded patents pertaining to thermally enhanced card retainers, heat pipe designs for high-heat-flux space-flight applications, and several patents pending for embedding computing thermal products.  Mr. Jens Weyant is currently the Manager for ACT’s Defense Aerospace products group which handles design, prototyping, and production of embedded computing thermal solutions

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